Conveners
[EI2] Micro and Nano Systems (From device to integrated systems): [EI6] Micro and Nano Systems (From device to integrated systems)-I
- Seonho Seok (C2N-CNRS-University of Paris Saclay)
- Jung Mu Kim (Jeonbuk National University)
[EI2] Micro and Nano Systems (From device to integrated systems): [EI6] Micro and Nano Systems (From device to integrated systems)-II
- Jung Mu Kim (Jeonbuk National University)
- Seonho Seok (C2N-CNRS-University of Paris Saclay)
Description
Evolution in IC (Integrated Circuit) packaging technology has been driven by the need for higher speed and higher density devices enabling smaller form factor and lower power consumption. For example, HBM (High Bandwidth Memory) has been developed by stacking memory die based on TSV (Through Silicon Vias) and stacking with micro-bump bonding in order to achieve higher bandwidth and thus lower power consumption. Furthermore, R&D effort and business drivers to speed up the development and application of “More than Moore” that are based upon or derived from silicon technologies but do not scale with Moore’s law (with typical examples as RF, Power/HV, Sensor/Actuator/MEMS,
SiP, SSL, etc.). Therefore, micro and nanosystems attracts more and more interests For a realization of more-moore or more-than-moore. This session will reveals the recent research trends and opportunities of micro and nano systems for future more-than-moore era.
Advanced fabrication technologies enable breakthroughs in electronic devices including biomedical applications and energy devices.[1-3] Emerging technologies include digitally-driven additive manufacturing which have demonstrated excellent capabilities in patterning-free low cost processes.
In this talk, a novel digitally driven direct-write method will be described and how this technology...
Artificial intelligence (AI) brings about significant advancements in various research areas such as visual perception, natural language processing, and autonomous vehicles. The traditional von Neumann computing architecture, which separates processing and memory units, is facing limitations due to the increasing data transfer requirements in AI applications. The fundamental operations of...
We propose MEMS antenna with user hand grip sensing functionality for 5G mmWave phased antenna system. The device is called “SENTENNA” which stands for SENsor and anTENNA. The SENTENNA is fabricated on two glass substrates. The top metal patch fabricated on the glass acts as a radiation patch of antenna and an electrode of capacitance sensing simultaneously. The proximity-coupled microstrip...
Micro-composites comprising conductive fillers dispersed within polymer matrices have been attracting attention as a versatile stretchable electrode material in the wearable sensor field (1). PDMS and MWCNT show great potential as the fundamental materials for stretchable electrodes, especially in operating environments that are subjected to cyclic loads (2). This work aims to examine the...
The necessity of managing stress levels is becoming increasingly apparent as the world suffers from different kinds of stress including the extent of pandemic, the corona virus disease 2019 (COVID-19). Cortisol, a clinically confirmed stress hormone related to depression and anxiety, affects individual mentally and physically. However, current cortisol monitoring methods require expert...
This talk will cover wireless sensor node and low-cost wearable wireless sensing technology for gas detection. Sensor designs use electromagnetic waves for detection, involving microwaves and optical technology. Sensor heads are fabricated using nanotechnology. Full prototype integration, sensor head design and results will be described. Microwave sensor design and implementation for...
