Conveners
[EI4] Innovative semiconductor devices and circuits, packaging and systems, and their scientific and industrial applications.: Innovative semiconductor devices and circuits, packaging and systems, and their scientific and industrial applications (Part I)
- Jung Han Choi (Fraunhofer Heinrich-Hertz Institute)
- Heungjae Choi (Cardiff University, Wales, UK)
[EI4] Innovative semiconductor devices and circuits, packaging and systems, and their scientific and industrial applications.: Innovative semiconductor devices and circuits, packaging and systems, and their scientific and industrial applications (Part II)
- Heungjae Choi (Cardiff University, Wales, UK)
- Jung Han Choi (Fraunhofer Heinrich-Hertz Institute)
Description
Rapid advances in semiconductor technologies, wide bandgap compound semiconductors such as GaN, high frequency materials and electronics, and the next generation wired and wireless communication systems allow us to deliver benefits to the society that have not been possible ever before, for example, 5G/6G, Internet of Things (IoT), and high-speed lower-power data centers. In parallel to this, the unique properties of electromagnetic waves enable the use of RF and Microwave technology as a platform for interdisciplinary research projects in tackling global challenges such as non-invasive physiological signal monitoring and rapid diagnosis of infectious diseases.
This session not only focuses on RF and microwave circuits and system design for the next generation wireless and wired communications, but also aims to invite researchers from fundamental Science and industry involved in interdisciplinary research projects who work with RF and microwave technology.
The presentation covers the current state of semiconductor optical sensors and applications, including case studies on sensor development through electrical and optical TCAD simulations. Various types of semiconductor optical sensors are becoming increasingly important in the IoT domain, especially in environmental, smart home & building, augmented reality, autonomous, wearable, and mobile...
o Background: The practical inverter model has frequency-dependent parameters, which mean that the designed filter may produce results that differ from the targeted filter specifications in terms of FBW changed and center frequency shifts. To address this issue, a frequency conversion function is proposed that takes into account the frequency dependency of the inverter characteristic impedance...
We present a 120 GBd 2.8 Vpp,diff driver for InP Mach-Zehnder modulator using 55 nm SiGe HBTs. The output impedance of the driver has a differential 2 × 25 Ω, matched to the optical modulator. The measured 3 dB bandwidth exceeds 67 GHz, and output P1dB is about 16.7 dBm at 1 GHz. The variable gain using the Gilbert-cell is implemented, and 2.1 dB gain variation is measured. The total harmonic...
Spectrum, in the context of mobile broadband communications, refers to the range of electromagnetic frequencies used for wireless transmission of data and information. Mobile carriers and service providers use different frequency bands within the spectrum to offer mobile data services, voice calls, and other wireless applications to end-users. Spectrum is a primary and yet scarce resource in...
The GaN is a representative wide band-gap compound semiconductor for efficient connectivity and energy systems in the future. The GaN is rapidly expanding in commercialization as a high-frequency HEMT using a 2DEG structure and a power-switching device having a high breakdown field. Among them, high-frequency power HEMT is applied to power amplifiers with wide-bandwidth characteristics and...
The burgeoning population and industrialization around the world have resulted in an immense surge in the demand for energy [1]. To meet this need, it is crucial to develop advanced technologies that can offer reliable and efficient solutions. Power semiconductor devices are vital components of a wide range of energy conversion and control systems, including power electronics and renewable...
The required frequency is increasing according to the communication generation and various researches such as MMIC and beamformer IC are being conducted accordingly. In addition, in order to safely mount these ICs and preserve designed performance, development of ceramic package is being actively conducted. Conventional ceramic packages focus on hermetic, reliability, high heat dissipation and...
