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Description
The required frequency is increasing according to the communication generation and various researches such as MMIC and beamformer IC are being conducted accordingly. In addition, in order to safely mount these ICs and preserve designed performance, development of ceramic package is being actively conducted. Conventional ceramic packages focus on hermetic, reliability, high heat dissipation and low loss. However, as the unit length of the transmission line decrease due to the increase the required frequency, there is a lack of commercialization research such as an antenna on/in package and an integrated package that includes an isolator or divider(or combiner). Therefore, in this paper, the main process for the the conventional package is introduced, and a Ka band antenna on package having broadband and high gain performance is proposed. The antenna on package proposed in this paper is based on a sinuous antenna in which a dipole and spiral are fused, rather than a planar patch array structure. As a result of simulation, it has bandwidth of 25GHz to 31GHz and the maximum gain was measured as 10.2dBi.
References
U. Ullah, N. Mahyuddin, Z. Arifin, M.Z. Abdullah, A. Marzuki, 'Antenna in LTCC Technologies :A Review and the Current State of the Art', IEEE Antennas and propagation Magazine, vol.57, pp.241-260, 2015
| Keywords | Ceramic Package, 5G communication, Ka band, Antenna on package, integrated package |
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